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Credit: MIT / Sampson Wilcox/Research Laboratory of Electronics
https://www.jone.live/2023/12/10/researchers-safely-integrate-fragile-2d-materials-into-devices/
https://www.nature.com/articles/s41928-023-01079-8
depressedscientist
I don’t understand. We were making devices like this 10 yrs ago. How is this new research? When I was getting my MS in nanotechnology in 2017 devices like this were being made by everyone in the field.
ctotheg2
In a single step without any adhesives?
depressedscientist
Yes. We even devices a method of mechanical transfer that utilizes temperature dependent Van derWaal forces before building a furnace where we could grow monolayers onto the semiconductor interface.
depressedscientist
Oh wow. I just read through the rest of it. They better have my paper cited or I’m going to be a little irritated.
depressedscientist
Yep. Not cited. We definitely published on that process in 2015
ctotheg2
Perfect you can prove that you achieved this many years before them!
depressedscientist
Found it. It was 2014. We created FETs using temperature controlled direct transfer. https://pubs.aip.org/avs/jvb/article-abstract/32/6/061203/103258/Multilayer-MoS2-transistors-enabled-by-a-facile?redirectedFrom=fulltext